Referenced Items are not available for this document.
The manufacture of six sigma quality high density interconnects by use of tin-lead solder flip chip bumps has prompted the application of computational analysis tools to assist in establishing the significance of variations of the bumps. Analytical model results and finite element predictions of solder joint geometry were compared to measured data. The solder geometric data and independently established component and substrate warpage were combined to calculate interconnect manufacturability
Published in:
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Date of Conference: 27-30 May 1998
- Page(s):
- 166 - 170
- Meeting Date :
- 27 May 1998-30 May 1998
- ISSN :
- 1089-9870
- Print ISBN:
- 0-7803-4475-8
- INSPEC Accession Number:
- 6118202
- Conference Location :
- Seattle, WA
- Digital Object Identifier :
- 10.1109/ITHERM.1998.689536
- Product Type:
- Conference Publications
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