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Natural convection air cooling of electronic components in partially open compact horizontal enclosures

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2 Author(s)
Yu, E. ; CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA ; Joshi, Y.K.

Experimental flow visualizations and temperature measurements are conducted to investigate the passive air cooling of electronic components in partially open horizontal enclosures. A discrete flush type heat source, centrally mounted on a horizontal substrate is placed in a compact enclosure of size 127 mm×127 mm×41.3 mm. Computations of combined convection, conduction and radiation are used to derive the convective heat transfer data. Pronounced effects of power levels, opening sizes, enclosure aspect ratios and opening configurations on the thermal performance of the discrete components and their interactions are found using a design of experiments methodology. Convective heat transfer coefficients are obtained which provide guidance for thermal design of compact horizontal enclosures

Published in:

Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on

Date of Conference:

27-30 May 1998