By Topic

A New Analysis of the Capillary Driving Pressure for Underfill Flow in Flip-Chip Packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Xing Jun Yao ; Dept. of Mater. & Equip. Eng., East China Univ. of Sci. & Technol., Shanghai, China ; Zheng Dong Wang ; Wen Jun Zhang

Control of the capillary driven underfill flow process is a very important problem in flip chip technology in electronics packaging. The challenge here is to uniformly distribute fluids in the gap, which is composed of the chip and substrate and solder bumps. In this paper, we first present a conceptual model of the flow behavior of underfill materials, which has four stages, leading to the finding that the contact line jump phenomenon occurs at both entry and exit of the solder bumps. We then propose a more accurate model for describing the flow front based on the principles of mass conservation and force equilibrium. Another contribution of the present paper is the proposal of a computational model for describing the average capillary pressure difference with respect to the area of flow. The verification of these models is presented by comparing the result calculated with our model with the experimental result reported in the literature, which shows the superiority of the models proposed in this paper.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:4 ,  Issue: 9 )