Close category search window
 

Profile engineering for sub-micron CMOS using high energy ion implantation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Stolmeijer, A. ; Philips Res. Lab., Eindhoven, Netherlands ; Pitt, M. ; den Blanken, H. ; van der Plas, P.A.
more authors

An improved implantation scheme has been developed for a submicron retrograde twin-well CMOS (complementary metal-oxide-semiconductor) process. A blanket p-well implantation is used to avoid one photoresist step. The use of a phosphorus compensating implantation for PMOS (p-channel MOS) transistor threshold voltage control avoids another resist step and photoresist processing on gate oxide. The latter results in an improved gate oxide integrity. The new implantation scheme has been successfully employed in the fabrication of a 1-Mb SRAM (static random-access memory) on 150-mm wafers

Published in:
VLSI Technology, Systems and Applications, 1989. Proceedings of Technical Papers. 1989 International Symposium on

Date of Conference: 17-19 May 1989

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.