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Characteristics of System in a Package of Synchronous Dynamic Random Access Memory for High-Speed Data Storage Applications

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2 Author(s)
Yeong-Lin Lai ; Dept. of Mechatron. Eng., Nat. Changhua Univ. of Educ., Changhua, Taiwan ; Wen-Jung Chiang

This paper proposes a system in a package (SiP) integrating a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) for advanced data-storage-based systems. The characteristics of high frequency, signal integrity (SI), and power integrity (PI) were investigated for the SoC/DDR3-SDRAM SiP. The SiP exhibited low insertion loss, wide eye-diagram aperture, and low power impedance. The effect of de-coupling capacitors on the SiP was also examined. The SoC/DDR3-SDRAM SiP achieved excellent performance for high-speed data storage applications.

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Magnetics, IEEE Transactions on  (Volume:50 ,  Issue: 7 )