Cart (Loading....) | Create Account
Close category search window

Effect of system orientation and cooling mechanism on component thermal impedances in an electronic enclosure

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Manno, V.P. ; Dept. of Mech. Eng., Tufts Univ., Medford, MA, USA ; Leisk, G. ; Azar, K.

An experimental investigation of the dependence of thermal impedance on a variety of typical design dependencies is discussed. Various thermal impedance formulations at the board, regional, and component levels are applied to the analysis of data derived from a simulated circuit pack array in an air-cooled enclosure. The utility of these measures for performance comparison, data analysis, modeling, and design extrapolation is illustrated. A component-level energy balance which is used to predict measured changes in peak component temperature as a function of power level and location of neighboring components is proposed. Neighboring component effects can increase effective component thermal impedance by more than 25%. Measured heat transfer coefficients are compared to literature values. The design issues of correcting for neighboring component effects and utilizing the concept of regional thermal impedances are explored

Published in:

Semiconductor Thermal and Temperature Measurement Symposium, 1990. SEMI-THERM VI, Proceedings., Sixth Annual IEEE

Date of Conference:

6-8 Feb 1990

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.