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Analysis and Design of a Novel Low-Loss Hollow Substrate Integrated Waveguide

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3 Author(s)
Lukui Jin ; Sch. of Electron. & Electr. Eng., Univ. of Leeds, Leeds, UK ; Lee, R.M.A. ; Robertson, I.

In this paper, a novel hollow substrate integrated waveguide (HSIW) is presented for realizing low-loss millimeter-wave (mm-wave) transmission lines embedded in multi-chip modules. A new analysis method for the HSIW is proposed by treating it as a combination of a two-dielectric loaded rectangular waveguide (RWG) and standard substrate integrated waveguide, where an effective dielectric constant, εe, is introduced. An HSIW prototype in the Ka-band is fabricated using a progressive-lamination low-temperature co-fired ceramic technique. The measured results agree well with theoretical calculations and simulations. An average of 0.009-dB/mm loss is achieved in Ka-band, which is comparable to an air-filled RWG. This shows that the technique has great potential for further development to realize highly integrated mm-wave modules.

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Microwave Theory and Techniques, IEEE Transactions on  (Volume:62 ,  Issue: 8 )