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Plastic microwave multi-chip modules for wireless communication applications

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7 Author(s)
Krishnamurthy, V. ; Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA ; Balch, E. ; Durocher, K. ; Rose, J.
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This paper describes a high density, microwave plastic multi-chip module (MCM) with vertical feed throughs providing RF/DC I/Os at the module backside allowing for a low thermal resistance solder attach to a printed circuit board. A return loss of better than -20 dB up to approximately 3.8 GHz was measured for the coplanar vertical interconnect from the plastic module to a printed circuit board. Functional T/R modules operating between 1.60 GHz and 2.0 GHz were also fabricated with this technology.

Published in:

Radio Frequency Integrated Circuits (RFIC) Symposium, 1998 IEEE

Date of Conference:

11-8 June 1998

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