By Topic

Effective modeling of the reflow soldering process: basis, construction, and operation of a process model

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
F. Sarvar ; Dept. of Manuf. Eng., Loughborough Univ. of Technol., UK ; P. P. Conway

Thermal history variation within printed circuit assemblies (PCAs) during reflow soldering is considered one of the main drivers for manufacturing defects. It is recognized that predictive tools could be used to identify the temperature variations that arise during the reflow process and, in conjunction with experimentally derived data, determine their impact on manufacturing quality. This paper describes the development of representative process models of the reflow soldering of PCAs and outlines some of the more important parameters to consider for accurate simulation of the reflow process. This first part also presents results which illustrate the variation with temperature of critical properties for electronic materials, such as for common substrate and epoxy based packaging materials

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C  (Volume:21 ,  Issue: 2 )