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A D&T Roundtable: Testing Mixed Logic and DRAM Chipshigher throughput devices has put the integration of DRAM into a new spectrum.]

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The ability to increase the bandwidth and number of I/Os from embedded DRAMs and to support 3D graphics and higher throughput devices has put the integration of DRAM into a new spectrum. Because of their impact on process technology and test, these devices present us with several new challenges. At a November 1997 roundtable, experts from a variety of specialties explored test impacts and the challenges ahead.

Published in:

Design & Test of Computers, IEEE  (Volume:15 ,  Issue: 2 )

Date of Publication:

April-June 1998

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