Cart (Loading....) | Create Account
Close category search window
 

A D&T Roundtable: Testing Mixed Logic and DRAM Chipshigher throughput devices has put the integration of DRAM into a new spectrum.]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.

The ability to increase the bandwidth and number of I/Os from embedded DRAMs and to support 3D graphics and higher throughput devices has put the integration of DRAM into a new spectrum. Because of their impact on process technology and test, these devices present us with several new challenges. At a November 1997 roundtable, experts from a variety of specialties explored test impacts and the challenges ahead.

Published in:

Design & Test of Computers, IEEE  (Volume:15 ,  Issue: 2 )

Date of Publication:

April-June 1998

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.