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Tracing the thermal behavior of ICs

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3 Author(s)
Szekely, V. ; Tech. Univ. Budapest, Hungary ; Rencz, M. ; Courtois, B.

Today's increased power and packaging densities demand designers' attention to the effects of heat on ICs. The authors review thermal and electrothermal simulation and measurement methods, thermal package characterization, and the concept and techniques of design for thermal testability

Published in:

Design & Test of Computers, IEEE  (Volume:15 ,  Issue: 2 )