Referenced Items are not available for this document.
Advanced measurement and modeling techniques are proposed in both the frequency domain and time domain to establish the high-frequency/high-speed equivalent models of Ball Grid Array (BGA) packages. In consideration of the adjacent coupled traces of the packages, the electrical parameters that are found include characteristic impedance, coupling coefficient, and propagation delay for the equivalent coupled transmission-line models, and self inductance, mutual inductance, loaded capacitance, and mutual capacitance for the equivalent lump models
Published in:
Electronic Components & Technology Conference, 1998. 48th IEEE
Date of Conference: 25-28 May 1998
- Page(s):
- 1464 - 1471
- Meeting Date :
- 25 May 1998-28 May 1998
- ISSN :
- 0569-5503
- Print ISBN:
- 0-7803-4526-6
- INSPEC Accession Number:
- 6102992
- Conference Location :
- Seattle, WA
- Digital Object Identifier :
- 10.1109/ECTC.1998.678938
- Product Type:
- Conference Publications
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