Referenced Items are not available for this document.
A wide range of advanced dielectric materials are available for use in high speed digital and RF/microwave printed circuit boards. These materials present new challenges in the manufacturing process, especially when they are combined in mixed or unbalanced structures. The properties of these materials are reviewed, and their impact on manufacturing in various product applications is discussed
Published in:
Electronic Components & Technology Conference, 1998. 48th IEEE
Date of Conference: 25-28 May 1998
- Page(s):
- 800 - 806
- Meeting Date :
- 25 May 1998-28 May 1998
- ISSN :
- 0569-5503
- Print ISBN:
- 0-7803-4526-6
- INSPEC Accession Number:
- 6083432
- Conference Location :
- Seattle, WA
- Digital Object Identifier :
- 10.1109/ECTC.1998.678799
- Product Type:
- Conference Publications
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