Ceramic ball grid array for AMD K6 microprocessor application

Reliability of ceramic ball grid arrays has been reported in previous studies. These studies were carried out with respect to the body size and assembly parameters. This paper will report on reliability of a relatively thin package (<1 mm) in a daughter card format. This format is typical of many mobile personal computers. In addition, we will describe the effect of thickness and card pad design on the second level reliability of the ceramic ball grid array. Impact of silicon die and continuous compressive load on reliability will also be described.