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Low cost/high volume laser modules using silicon optical bench technology

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14 Author(s)
Osenbach, J.W. ; Bell Lab. Innovation, Lucent Technol., Breinigsville, PA, USA ; Dautartas, M.F. ; Pitman, E. ; Nijander, C.
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Reports on the use of SiOB technology used in the production of low cost/high volume, reliable edge emitting laser modules. The SiOB platform is designed for manufacturability, reduced parts count, reduced process steps, and ability to accept design changes to respond to a rapidly changing marketplace. For example, this SiOB technology has been used for at least four different laser designs/types without significant changes in the process. The SiOB technology is the first of its kind in that it integrates: i) silicon micromachining for the lens holder cavities and back face monitor turning mirror, ii) Ti/Pt/Au for interconnect metalization, photodiode bonding, and turning mirror iii) aluminum for AlO bonding attachment of the lens, and iv) Au/Sn solder for laser attachment. The laser and photodiode are passively aligned using a visual alignment system and fiducials on the silicon. The lens is self-aligned to the silicon during the AlO bonding process

Published in:

Electronic Components & Technology Conference, 1998. 48th IEEE

Date of Conference:

25-28 May 1998