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Barium titanate/epoxy composite dielectric materials for integrated thin film capacitors

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3 Author(s)
Shurong Liang ; Dept. of Mater. Sci. & Eng., Cornell Univ., Ithaca, NY, USA ; Chong, S.R. ; Giannelis, E.P.

Integration of passive components into electronic packaging will lead to further structural miniaturization, performance and reliability improvements, as well as cost reduction in the microelectronics industry. To replace the discrete capacitors currently employed in packages with the embedded ones, suitable dielectric materials and thin film processes compatible with the PWB technology are desired. Toward this end, we have been investigating a thin film technology based on barium titanate (BaTiO3)/epoxy composites, whose advantages in terms of processability, low processing temperature, and versatility make it quite promising. In this process, the homogeneous dispersion of fine-grained barium titanate into the epoxy matrix was achieved through the surface functionalization of the ceramic powders with a silane coupling agent. Particulate coatings were formulated using the functionalized barium titanate powders, bisphenol A epoxy resin, dicyandiamide, and 2-methylimidazole in an organic solvent. The composite dielectric thin layers were processed on Cu substrates by spinor dip-coating followed by curing at 175°C. Electrical measurements on these capacitors demonstrate that, for composite dielectric films containing 60 vol% of barium titanate, a dielectric constant of about 40 at 1 kHz and low loss factors of less than 0.035 over a wide frequency region have been obtained

Published in:

Electronic Components & Technology Conference, 1998. 48th IEEE

Date of Conference:

25-28 May 1998