Cart (Loading....) | Create Account
Close category search window
 

Thermal simulation and validation of the fast static RAM 164-lead FC-PBGA package with investigations of package thermal performance in a generic CPU module

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Eyman, M. ; Motorola Inc., Austin, TX, USA ; Johnson, Z. ; Joiner, B.

The steady-state thermal performance of the 164-lead flip chip plastic ball grid array (FC-PBGA) under low to moderate convective air cooling conditions has been simulated through finite element (FE) methods and computational fluid dynamics (CFD) methods. Experimental measurements taken with thermal test vehicles of this package were used to validate the simulations. Packages with three different substrates were investigated. Package performance has been presented in the form of a linear relationship between the normalized junction-to-ambient thermal resistance (θJA) versus the normalized board-to-ambient thermal parameter (ψBA). Results cast in this form represent a first-order thermal figure of merit for packages. Such a figure of merit can be used to rank in a consistent manner the thermal performance of different package types. A CFD study was performed to investigate the thermal performance of the package on a central processing unit (CPU) module assembly. A parametric study was performed to investigate the die temperatures as a function of thermal interface materials and heat sink configuration. Sink solutions were studied. The results of those board-level simulations give a reasonable indication of how the package would perform in a workstation environment

Published in:

Electronic Components & Technology Conference, 1998. 48th IEEE

Date of Conference:

25-28 May 1998

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.