Referenced Items are not available for this document.
A review is given of high temperature reliability efforts on solid-state electronic components. To date, most of this work has been concerned with high temperature stressing, usually for short periods of time (less than 100 hours) to demonstrate stability. To field high temperature devices in the future, comprehensive high temperature reliability studies will be required
Published in:
High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
Date of Conference: 14-18 Jun 1998
- Page(s):
- 148 - 150
- Meeting Date :
- 14 Jun 1998-18 Jun 1998
- Print ISBN:
- 0-7803-4540-1
- INSPEC Accession Number:
- 6103083
- Conference Location :
- Albuquerque, NM
- Digital Object Identifier :
- 10.1109/HITEC.1998.676777
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
