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Reliability of high temperature electronic components

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1 Author(s)
W. T. Anderson ; Naval Res. Lab., Washington, DC, USA

A review is given of high temperature reliability efforts on solid-state electronic components. To date, most of this work has been concerned with high temperature stressing, usually for short periods of time (less than 100 hours) to demonstrate stability. To field high temperature devices in the future, comprehensive high temperature reliability studies will be required

Published in:

High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International

Date of Conference:

14-18 Jun 1998