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Chip-Level 1 \times 2 Optical Interconnects Using Polymer Vertical Splitter on Silicon Substrate

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12 Author(s)
Chin-Ta Chen ; Dept. of Opt. & Photonics, Nat. Central Univ., Jhongli, Taiwan ; Po-Kuan Shen ; Teng-Zhang Zhu ; Chia-Chi Chang
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The chip-level 1 × 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 1 × 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45 ° reflectors. The high-frequency transmission lines combined with the indium solder bumps are developed to flip-chip assemble a vertical-cavity surface-emitting laser chip at the input port and two photodetector chips at two output ports. Total transmission loss of -3.26 dB with a splitting ratio of 1 : 1 for the proposed splitter is experimentally obtained. A 10-Gbit/s data transmission with bit error rates better than 10-12 for two output ports is achieved. It reveals that such chip-level 1 × 2 optical interconnects using the polymer vertical splitter are suitable for high-speed data transmission with multiple output ports.

Cross-sectional illustration of the chip-level 1 $times$ 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate. Cross-sectional illustration of the chip-level 1 $times$ 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate.

Published in:

Photonics Journal, IEEE  (Volume:6 ,  Issue: 2 )