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40 Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

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5 Author(s)
Y. Miyamoto ; NTT Opt. Network Syst. Labs., Kanagawa, Japan ; M. Yoneyama ; Y. Imai ; K. Kato
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A 10 Gbit/s optical receiver module has been designed with special regard to interconnection between a baseband distributed-amplifier IC and a waveguide PIN photodiode (WGPD) using a flip-chip bonding technique. A 40 Gbit/s receiver sensitivity of -23.5 dBm was experimentally obtained

Published in:

Electronics Letters  (Volume:34 ,  Issue: 5 )