Referenced Items are not available for this document.
A 10 Gbit/s optical receiver module has been designed with special regard to interconnection between a baseband distributed-amplifier IC and a waveguide PIN photodiode (WGPD) using a flip-chip bonding technique. A 40 Gbit/s receiver sensitivity of -23.5 dBm was experimentally obtained
Published in:
Electronics Letters
(Volume:34
,
Issue:
5
)
Date of Publication: 5 Mar 1998
- Page(s):
- 493 - 494
- ISSN :
- 0013-5194
- INSPEC Accession Number:
- 5872750
- Digital Object Identifier :
- 10.1049/el:19980337
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- 5 Mar 1998
- Sponsored by :
- Institution of Engineering and Technology
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