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Modification of polyethylene properties by encapsulation of inorganic material

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4 Author(s)
Vanga-Bouanga, C. ; Inst. de Rech. d'Hydro-Quebec, Varennes, QC, Canada ; Savoie, S. ; Frechette, M.F. ; David, E.

This study investigated the effect of various ceramic micro and nano fillers on the different properties (dielectric and thermal) of a polyethylene (PE) matrix. The fillers used were alumina (Al2O3) and boron nitride (BN). The polymer composites were prepared by ball milling and thick films containing wt. 50% of the inorganic phase were pressed. The encapsulation of the inorganic additives into the PE matrix was successfully achieved. The real part of the dielectric permittivity of a microcomposite containing Al2O3 was found to be close to that of the PE matrix value whereas the losses remained quite low. Thermal conductivity of PE was greatly improved: it increased by about 50% irrespective of the nature and size of the fillers. When the filler was nano BN, the breakdown strength was found to be slightly reduced by only 5%. This could be due to the size of the particles or to the high percentage of additives and the interface behavior of the fillers/matrix. Improvement of the PE surface resistance to discharges was achieved, specially with using nano-BN.

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Dielectrics and Electrical Insulation, IEEE Transactions on  (Volume:21 ,  Issue: 1 )