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A novel integrated decoupling capacitor for MCM-L technology

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4 Author(s)
Chahal, P. ; Georgia Inst. of Technol., Atlanta, GA, USA ; Tummala, R.R. ; Allen, M.G. ; Swaminathan, M.

This paper discusses the design, materials, fabrication, and measurements of a novel integrated decoupling capacitor for MCM-L-based substrates, Based on modeling using the Semiconductor Industry Association Roadmap, it has been estimated that 13-72 nF/cm2 of specific decoupling capacitance will be required for the next decade, The capacitor in this paper addresses this need. The fabrication of the capacitor has been achieved using filled polymer materials in thin film form, with via diameters of 100 μm and below, through photodefinable processes. Dielectric constant as high as 65 with loss tangent below 0.05 and specific capacitance of 22 nF/cm2 have been achieved. The scattering parameters were measured up to 20 GHz using a network analyzer for various capacitor structures (varying geometry and dielectric thickness) to study input impedance and scaling of the devices

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:21 ,  Issue: 2 )

Date of Publication:

May 1998

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