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Packaging of large-scale planar lightwave circuits

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3 Author(s)
Kato, K. ; NTT Opto-Electron. Labs., Ibaraki, Japan ; Ishii, M. ; Inoue, Y.

This paper describes the packaging of large-scale silica-based planar lightwave circuits (PLC's), fabricated on Si substrates. They include arrayed-waveguide grating (AWG) multiplexers and star couplers with more than 32 channels, and optical matrix switches with a scale of 8×8 or greater. These devices all have a large channel-number or a large number of switch elements. There are various technological objectives and techniques related to large-scale PLC's which concern their optical, electrical, thermal, and mechanical characteristics. Several techniques are presented in detail based on experimental results

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:21 ,  Issue: 2 )