Cart (Loading....) | Create Account
Close category search window

Micromachined high-frequency ZnO ultrasonic linear arrays

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
7 Author(s)
Zhang, J.Y. ; Coll. of Comput., Nat. Univ. of Defense Technol., Changsha, China ; Xu, W.J. ; Han, G. ; Carlier, J.
more authors

ZnO thin film has been widely applied in high-frequency acoustic microscopy using single element transducer. It needs mechanical scanning which is much more time-consuming than electronic scanning with transducer array. However, one of the challenges in the implementation of ZnO transducer array is the patterning of small scale features in the array elements. In this paper, a controllable wet-chemical etching method is investigated to fabricate high-frequency ZnO-based ultrasonic transducer arrays. The wet-chemical etchant is NH4Cl aqueous solution with a concentration of 10 wt% and the etching rate is 53 nm/min at room temperature. A ZnO array is achieved with a small ratio (0.25) of lateral etching to vertical etching. Finite element method is employed to calculate acoustic field, electrical impedance and crosstalk of the transducer. The characteristics of the transducer are measured and compared to the theoretical predictions. This etching method provides a possibility to acquire a pitch of a λ in a 300 MHz array. It indicates that the proposed wet etching is promising in the fabrication of high-frequency ZnO transducer arrays.

Published in:

Ultrasonics Symposium (IUS), 2013 IEEE International

Date of Conference:

21-25 July 2013

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.