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New low cost interconnection materials for high frequency MCM applications

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3 Author(s)
Keusseyan, R.L. ; Dupont Electron., Research Triangle Park, NC, USA ; Amey, D.I. ; Horowitz, S.J.

A new “high density” gold thick film technology is introduced. Circuits produced using the new material system exhibit superior fine line definition, conductivity density and high frequency performance. The high frequency performance of etched “high density” gold circuits were found to be superior to etched thin film circuits in the GHz range

Published in:

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on

Date of Conference:

15-17 Apr 1998