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Eye-diagram simulation and analysis of a high-speed TSV-based channel

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8 Author(s)
Heegon Kim ; TERA Lab., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea ; Jonghyun Cho ; Kim, J.J. ; Jung, D.H.
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In this paper, the worst-case and statistical eye-diagrams of high-speed TSV-based channel are simulated and analyzed. To analyze the electrical characteristic of TSV-based channel, the eye-diagrams with various TSV and silicon interposer interconnect structures are simulated and compared each other. In addition, the single-channel bandwidth in accordance with the channel types and the metal widths of the silicon interposer interconnect are investigated based on the simulated eye-diagrams. By using the obtained single-channel bandwidth of the high-speed TSV-based channel, the escaping bandwidth that corresponds to the total bandwidth of the TSV-based system is also investigated.

Published in:

3D Systems Integration Conference (3DIC), 2013 IEEE International

Date of Conference:

2-4 Oct. 2013