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Analysis of glass interposer PDN and proposal of PDN resonance suppression methods

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5 Author(s)
Jonghyun Cho ; Dept. of Electr. Eng., KAIST, Daejeon, South Korea ; Youngwoo Kim ; Joungho Kim ; Sundaram, V.
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Electrical characteristics of glass interposer PDN is analyzed and compared with silicon interposer. Because of the low loss of glass substrate compared to silicon substrate, glass interposer has much smaller loss than silicon interposer. It helps low-loss signaling, but it generates sharp PDN resonance unlike silicon interposer. If glass interposer signal line has through-glass via (TGV), it experiences high loss at the resonance frequency. Also P/G noise is easily coupled to signal line and vice versa at that frequency. It would be problems for the glass interposer PDN design. To overcome these problems of glass interposer, several resonance suppression methods are proposed such as decoupling capacitor scheme, ground via.

Published in:

3D Systems Integration Conference (3DIC), 2013 IEEE International

Date of Conference:

2-4 Oct. 2013