Cart (Loading....) | Create Account
Close category search window
 

Low-Cost Metamaterial Absorbers for Sub-GHz Wireless Systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Costa, F. ; Dept. of Inf. Eng., Univ. of Pisa, Pisa, Italy ; Genovesi, S. ; Monorchio, A. ; Manara, G.

The possibility of realizing low-cost ultra-thin and angularly stable absorbers at low frequencies is investigated. It is demonstrated that ultra-thin absorbers comprising metallic high impedance surfaces can be realized by using a low-cost fabrication process. This approach opens up the realistic possibility of employing such absorbing panels to improve the performance of wireless systems operating in complex environments (e.g., radio frequency identification systems). The substrate here employed is a common cardboard panel, and the metallized parts are realized through a conventional aluminum foil or by using a commercial spray paint used for shielding. Experimental tests are provided both in a waveguide environment at 5 GHz and in free space at 868 MHz.

Published in:

Antennas and Wireless Propagation Letters, IEEE  (Volume:13 )

Date of Publication:

2014

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.