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This paper presents the design of a directional folded dipole antenna integrated in an embedded wafer level ball grid array (eWLB) package, the comparison of different antenna designs and the influence of the silicon die and neighboring antennas within the package to the radiation behavior. The co-integration of the antenna and the silicon-based monolithic microwave integrated circuit (MMIC) in a system in package (SiP) approach is a convenient solution to suppress lossy radio frequency (RF) transitions and to simplify the design and the manufacturing of radio frontends significantly. The proposed SiP is focused on 77-GHz automotive radar applications. The MMIC contains the 77-GHz signal source and a transceiver with amplifier and mixer. The gain of different antennas in different constellations within the package is shown.