By Topic

Electromagnetic modelling and simulation of multiconductor interconnect networks with inhomogeneous cylindrical substrate

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kolbehdari, M.A. ; Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada ; Nakhla, M.S.

A new and efficient technique is presented for modelling and simulation of interconnect networks which include multiconductor microstrip transmission lines (MMTL) with inhomogeneous cylindrical substrates. The potential and field distributions in the cross section of the MMTL are calculated by solving a set of series equations using Galerkin's method. The charge distribution on the conductors, Maxwellian capacitance matrix per unit length, and the modal characteristic impedances of the MMTL are determined. Results obtained have been compared for various types of microstrip lines with those obtained in the literature; good agreement has been found

Published in:

Microwaves, Antennas and Propagation, IEE Proceedings  (Volume:144 ,  Issue: 5 )