By Topic

Wire bonding process control using fuzzy logic

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
C. Kinnaird ; Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA ; A. Khotanzad

This paper describes a method of setting parameters for the wire bonding process using a fuzzy logic controller. The design of the fuzzy engine and the development of rules based on operator experience are discussed. Bonded ball size and shear strength density are the specific characteristics controlled. Experimental testing with standard wire bonders has resulted in improved process control

Published in:

Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on

Date of Conference:

6-8 Oct 1997