By Topic

In-line defect detection metrology tool matching

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Funsten, B. ; Adv. Micro Devices Inc., Sunnyvale, CA, USA ; Ogawa, A. ; Lui, D.

This paper is a case study of our experience matching five darkfield defect detection tools (Inspex model 8530) used for both patterned and unpatterned wafers, in a 0.25 um and beyond development/production facility, producing both logic and memory technologies. Two of the systems were new tools and three were existing tools upgraded to identical capability. In this implementation, sensitivity, count reproducibility, defect position reproducibility, throughput, and recipe transfer from tool to tool were of major concern. This study discusses the degree of tool matching obtained as well as the lessons learned from the project approach and methodology

Published in:

Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on

Date of Conference:

6-8 Oct 1997