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Modeling the die attach adhesives process

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3 Author(s)
Taweeplengsangsuke, J. ; Mater. Res. Center, Lehigh Univ., Bethlehem, PA, USA ; Hsiung, J.-C. ; Pearson, R.A.

Multi-step curing was performed to reduce the residual cure stress in the polymeric adhesives. The longer the period of time at the lower temperature step of the 2-step curing gave the lower cure stress. In addition, the stress during the cool down process was investigated. At the point of decreasing temperature, the stress dramatically increases. The higher temperature difference, the larger the residual stress

Published in:

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Date of Conference:

15-18 Mar 1998