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Microvia technology in MCM-D/L-need, challenge, and response

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2 Author(s)
Weiping Li ; Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA ; Tummala, R.

This paper discusses the performance and cost needs of high-density wiring substrates and the challenges to the materials and processes of MCM-D/L technology. The approach proposed by the Packaging Research Center (PRC) at Georgia Tech to meet these needs and challenges is presented along with some up-to-date advances in microvia technology. Finally, further research and development planned on microvia technology is presented

Published in:

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Date of Conference:

15-18 Mar 1998