By Topic

Thin film polymeric materials in microelectronic packaging and interconnect

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)

Polymeric materials in the form of thin film insulating layers are finding increased application in a variety of microelectronic applications. The SIA IC roadmap shows the industry moving towards thin film polymers vs conventional SiO2 dielectric for on chip interconnect. Photo polymers are being used as stress buffer/passivation layers on top of Si and GaAs chips and to redistribute peripheral pads on chips to area array bumps. Thin film materials are also being used to route interconnect on laminate, ceramic and silicon substrates; interconnect passive components; form optical waveguides for short haul optical interconnect and serve as planarization and alignment layers in flat panel displays

Published in:

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Date of Conference:

15-18 Mar 1998