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This paper reports the design, micro-fabrication and evaluation results of a novel 3-by-3 arrayed MEMS accelerometer by exploiting gold electroplating. High density of gold for the proof mass has allowed us to downscale the device size without compromising the sensitivity. Moreover, the gold electroplating with the maximum process temperature of below 400 °C can be used as a reliable post-CMOS process for implementing MEMS sensor onto a sensing LSI chip. The accelerometer has been developed for a CMOS-MEMS motion sensor, where a wide range of detection and a minimal chip size would help to continuously monitor various human activities.