By Topic

A high aspect ratio MEMS process with surface micromachined polysilicon for high accuracy inertial sensing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Geisberger, A. ; Sensor & Actuator Solution Div., Freescale Semicond., Inc., Tempe, AZ, USA ; Schroeder, S. ; Dixon, J. ; Suzuki, Y.
more authors

A unique process is described that has the advantages of high aspect ratio, deep reactive ion etched, single crystal silicon with the diversity of polysilicon surface micromachining to enable advances in capacitive inertial sensing. This process has been designed to incorporate a fully released via between the two structural layers which considerably increases the design capabilities, providing a means for improved package stress isolation and area efficiency. A high accuracy low-g XY accelerometer for the automotive electronic stability control market is presented using this technology.

Published in:

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on

Date of Conference:

16-20 June 2013