Cart (Loading....) | Create Account
Close category search window

Influence of Different Surface Treatments on the Heat Flux From Solids to Liquid Nitrogen

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Hellmann, S. ; Inst. for Tech. Phys. (ITEP), Karlsruhe Inst. of Technol. (KIT), Eggenstein-Leopoldshafen, Germany ; Noe, M.

In this work, a quasi-stationary procedure has been applied to analyze the heat flux from copper samples to liquid nitrogen (LN2). The purpose is to quantify the influence of the surface treatment on the heat flux. Copper samples with different surface roughness as well as copper samples whose surface had been previously laminated with commercially available Kapton (lamination or self-adhesive tape) have been tested. The experimental procedure consisted in cooling down the copper samples in a liquid nitrogen bath from room temperature to 77.3 K (boiling temperature of LN2 at atmospheric pressure). During the cool-down, the temperature has been measured and recorded. From the measured temperature data, the heat flux and the boiling curve were calculated for each copper sample. According to the experimental results, the surface roughness does not have a general influence on the cooling behavior. Regarding the laminated samples, results show a significant change in the boiling curve. In this case the cooling capability in LN2 is therefore enhanced. This behavior is due to the low thermal-conductivity of the lamination material. Indeed, that leads to a small temperature difference between the lamination and the coolant.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:24 ,  Issue: 3 )

Date of Publication:

June 2014

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.