By Topic

Investigation of high-temperature degradation of platinum thin films with an in situ resistance measurement apparatus

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Firebaugh, S.L. ; MIT, Cambridge, MA, USA ; Jensen, K.F. ; Schmidt, M.A.

Many microfabricated systems require metallizations that can withstand high temperatures. In particular, a microfabricated chemical reactor system which we are investigating needs thin metal films for heating and temperature sensing that can withstand prolonged 1000°C exposure. The current microreactor metallization, a 100-nm platinum film with a 10-nm titanium adhesion layer, degrades at temperatures greater than 700°C. This degradation was examined with a custom-built high-temperature resistance measurement apparatus in addition to chemical analysis, scanning electron microscopy (SEM), atomic-force microscopy (AFM) and wafer curvature measurements. Thicker films and coating layers increased the lifetime of these films while exposure to oxygen decreased lifetime, consistent with the hypothesized degradation mechanism of agglomeration

Published in:

Microelectromechanical Systems, Journal of  (Volume:7 ,  Issue: 1 )