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Integrated circuit technology options for RFICs-present status and future directions

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1 Author(s)
Larson, L.E. ; Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA

This paper will summarize the technology tradeoffs that are involved in the implementation of radio frequency integrated circuits for wireless communications. Radio transceiver circuits have a very broad range of requirements-including noise figure, linearity, gain, phase noise, and power dissipation. The advantages and disadvantages of each of the competing technologies-Si CMOS and bipolar junction transistors (BJTs), Si/SiGe HBTs and GaAs MESFETs, PHEMTS and HBTs will be examined in light of these requirements

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:33 ,  Issue: 3 )

Date of Publication:

Mar 1998

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