By Topic

Thermal management of high-power electronics modules packaged with interconnected parallel plates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Haque, S. ; Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA ; Kun Xing ; Suchicital, Carlos ; Nelson, D.J.
more authors

The Virginia Power Electronics Center at Virginia Tech has developed a low cost approach for packaging of power electronics building blocks (PEBB) consisting of power semiconductor devices, drivers, controls, sensors and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. The new concept of PEBB packaging, termed metal posts interconnected parallel plate structure (MPIPPS), is based on direct bonding of copper posts to interconnect power devices, thus eliminating wire-bonding with aluminum wires. The interior space between the parallel plates and copper posts can be used as a flow channel for heat dissipation by a dielectric fluid, or filled with a solid or liquid for additional heat spreading. This approach requires less expensive processing equipment and has the potential to produce cost-effective high power modules that have superior electrical, thermal, and mechanical performance. This paper presents the materials selection and fabrication techniques developed in the course of the research and initial electrical and thermal characterization of the MPIPPS structure

Published in:

Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE

Date of Conference:

10-12 Mar 1998