By Topic

Concurrent thermal design for high-power electronics

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
B. S. Lall ; Crown Int. Inc., Elkhart, IN, USA

Concurrent thermal design with analysis of different aspects is critical to the current trend to reduce costs and time-to-market. Computer models are used with increasing frequency in the electronics industry to predict thermal performance of heat sinks and systems. Thermal performance plays a governing role in design optimization with significant considerations for assembly and compactness constraints. Design aspects for a 744 W dissipation electronics unit are presented in this paper. Computational fluid dynamics (CFD) simulations for three-dimensional forced convection with parameter sensitivity results were performed to design an optimized heat sink. Results from these CFD simulations were combined with a thermal network to predict maximum heat sink temperatures. Stress analysis was performed to optimize the rigidity of the front grille while minimizing flow impedance. Agreement to within 10% of experimental results was obtained for the optimized system thermal performance. The optimized design meets the thermal specifications in a compact space at low cost and is easy to manufacture

Published in:

Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE

Date of Conference:

10-12 Mar 1998