By Topic

Xs-MET-a reduced complexity fabrication process using complementary heterostructure field effect transistors for analog, low power, space applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

15 Author(s)
Cerny, C.L. ; Wright Lab., Wright-Patterson AFB, OH, USA ; Via, G.D. ; Ebel, J.L. ; DeSalvo, G.C.
more authors

The requirements for space-based integrated circuit applications are defined with an emphasis on being radiation tolerant and low power consuming. Flexible analog signal processors (FASPs) are outlined as a means by which effective circuit designs can be utilized to perform a multitude of tasks. The development of complementary III-V technologies have been proven to meet the demands of the space environment, and have demonstrated the potential for frequency operation beyond 1 GHz using power supply voltages at or below 1.5 Volts. The novel fabrication process known as Xs-MET (pronounced kismet, which uses the Creek letter chi, X, and stands for Complementary Heterostructure Integrated Single Metal Transistor), is introduced as a manufacturing technique to be used in FASP design. The Xs-MET fabrication process is outlined with preliminary device results presented. An example of a FASP circuit design using Xs-MET is provided. Conclusions regarding the utilization of the Xs-MET process for FASPs are outlined with comments focusing on a space-based demonstration

Published in:

Aerospace and Electronic Systems Magazine, IEEE  (Volume:13 ,  Issue: 3 )