By Topic

Retrieving Leaf Area Index From Landsat Using MODIS LAI Products and Field Measurements

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Feng Gao ; Agric. Res. Service, Hydrol. & Remote Sensing Lab., U.S. Dept. of Agric., Beltsville, MD, USA ; Martha C. Anderson ; William P. Kustas ; Rasmus Houborg

Land surface models that operate at multiple spatial resolutions require consistent leaf area index (LAI) inputs at each scale. In order to produce LAI from Landsat imagery that is consistent with the Moderate Resolution Imaging Spectroradiometer (MODIS) LAI product and with in situ measurements, an improved regression tree mapping approach has been developed, which uses homogeneous and high-quality LAI retrievals from MODIS and existing LAI measurements acquired on the ground as samples to train a rule-based model based on Landsat surface reflectance data in visible and infrared bands. The methodology employs a simple geostatistical approach for determining sample weight, considering the spatial distribution of the samples and data quality. Results from the Soil Moisture Experiment of 2002 field campaign show that incorporation of available ground-based LAI measurements into the training sample collection improved field-scale estimation of LAI, especially in areas of very high vegetation cover fraction, but did not degrade consistency with MODIS LAI products.

Published in:

IEEE Geoscience and Remote Sensing Letters  (Volume:11 ,  Issue: 4 )