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Electrical design of a cost-effective thermal enhanced plastic ball grid array package-NuBGA

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2 Author(s)
J. H. Lau ; Express Packaging Syst. Inc., Palo Alto, CA, USA ; Tai-Yu Chou

An electrically and thermally optimized plastic ball grid array (PBGA) package, called new and useful ball grid array (NuBGA) is presented. NuBGA is a cavity down package with a metal heat spreader covering the entire back-side of the chip. The heat spreader is laminated with a single-core double-sided organic substrate. Super electrical performance is achieved by using the split-wrap-around (SWA) or split-via-connection (SVC) design concepts. All traces on the core substrate are designed into μ-stripline and co-planar stripline structures. In this paper, the focus is on (1) the unique design concepts; (2) the electrical measurement; (3) the electrical analysis; (4) the electrical performance comparison with other standard packages

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:21 ,  Issue: 1 )