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A high peformance MCM-D/C application

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5 Author(s)
Perfecto, E.D. ; IBM Microelectron., Hopewell Junction, NY, USA ; Longworth, H.P. ; Sherif, R.A. ; Ellsworth, M.J.
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Mid-range computer performance is fast approaching speeds once considered appropriate for only high-end systems. IBM mid-range computer performance enhancement is enabled by the PowerPC RISC technology and the ability to effectively package the chips to maximize their electrical performance. MCM-D/C, coupled with IBM's controlled collapsed chip connection (C4) offers an optimized solution for high performance modules. This paper describes a state-of-the-art seven chip MCM-D/C package currently under production for use as a processor module for the high end of IBM's AS/400 Advanced Series with PowerPC. The package consist of a 63.0 mm metallized ceramic PGA substrate with 5 levels of Cu-Polyimide nonplanar thin films. It provides the interconnection for 7 high-performance Bi-CMOS logic and memory chips. Each chip has over 2600 C4 connections divided between power, signal and ground. The terminal metal layer provides the C4 pads for chip connection, as well as special repair wiring available for the repair of defects created during the fabrication process. Up to 220 watts are dissipated with air cooling while maintaining high module reliability

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:21 ,  Issue: 1 )