By Topic

Low cost, room temperature debondable spin-on temporary bonding solution: A key enabler for 2.5D/3D IC packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)
John, R.S.E. ; Dow Corning Corp., Midland, MI, USA ; Meynen, H. ; Sheng Wang ; Peng-Fei Fu
more authors

We report the development of a bi-layer spin on temporary bonding solution (TBS) which eliminates the need for specialized equipment for wafer pretreatment to enable bonding or wafer post treatment for debonding. Thus it greatly increases the throughput of the temporary bonding/debonding process. It also provides a total thickness variation (TTV) of less than 1 μm for spin coated films on both 200 mm and 300 mm wafers which enable the TTV of 300 mm bonded pairs to be 2-3 μm for bumped wafers using 70 and 100 μm thick adhesive films after backgrinding for an unoptimized bonding process. Furthermore, we have demonstrated the chemical and thermal stability of both the material and the bonded pair by exposing the bonded wafer pair to common chemicals (phosphoric acid, nitric acid, organic solvents etc.) and temperature conditions (up to 300 C) used in the TSV process. Additionally, the time taken for the entire spin coat-bond-debond process was less than 15 minutes with room for further improvement. Based on the current results, it is expected that the current bi-layer based temporary bonding solution has the potential to play an important role in enabling the high volume manufacturing of 2.5D/3D IC stacking.

Published in:

Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd

Date of Conference:

28-31 May 2013