Cart (Loading....) | Create Account
Close category search window

Parasitic elements modelling in thermoelectric modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Cernaianu, M.O. ; Appl. Electron. Dept., Politeh. Univ. of Timisoara, Timisoara, Romania ; Gontean, A.

This study introduces an experimental method for determining the parasitic reactive components that appear in a thermoelectric module (TEM). In most cases, a TEM is referred to by taking into account only the constant values of the internal electrical resistance, Seebeck coefficient and thermal conductivity. The current research is focused on determining the parasitic reactive elements, inductance and capacitance that appear in a TEM. These values are linked to the semiconductor geometry and manufacturing process. The experimental results will be used afterwards to build an accurate thermoelectric device model suitable for designing and simulating TEM-based applications.

Published in:

Circuits, Devices & Systems, IET  (Volume:7 ,  Issue: 4 )

Date of Publication:

July 2013

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.