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High RF performance improvement using surface passivation technique of AlGaN/GaN HEMTs at K-band application

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7 Author(s)
Lee, B.H. ; Samsung Thales Co., Yongin, South Korea ; Kim, R.H. ; Lim, B.O. ; Choi, G.W.
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A surface passivation technique of high electron mobility transistor (HEMT) devices is reported. The passivated HEMT device has a much higher RF performance of FT and Fmax than a non-passivated one. The AlGaN/GaN HEMT has a short gate length of 0.15 μm using an E-beam lithography system and very low ohmic contact resistance of 1.3 × 10-6 Ωcm-2 using a rapid thermal processing alloy system. In addition, to protect the active layer from the surface trap, an SiO2 thin film passivation process is applied by the plasma-enhanced chemical vapour deposition system. The fabricated AlGaN/GaN HEMT exhibits a maximum drain current of 900 mA/mm and a maximum transconductance of 320 mS/mm. In particular, this device produces excellent RF performance of small-signal characteristics, such as a current gain cut-off frequency (fT) of 55 GHz and maximum oscillation frequencies (fmax) of 130 GHz.

Published in:

Electronics Letters  (Volume:49 ,  Issue: 16 )

Date of Publication:

Aug. 1 2013

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