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Properties of silicon thin films grown by the temperature difference method (TDM)

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4 Author(s)
Thomas, B. ; Inst. fur Kristallzuchtung, Berlin, Germany ; Muller, G. ; Wilde, P.-M. ; Wawra, H.

In this paper we describe the temperature difference method (TDM) as a promising technology for the continuous growth of thin film silicon from the solution on large area polycrystalline substrates (10×10 cm2). The thermodynamic driving force of the layer growth by TDM is generated by a temperature gradient perpendicular to the substrate surface. Silicon thin films have been grown from In/Ga-solutions at 980°C. A temperature gradient of 10 K/cm allows a growth rate of 0.3 μm/min. Doping concentrations from 1016 to 2×1018 cm-3 are adjustable. Minority charge carrier life times of 5-10 μs were determined in 30 μm thick layers by TRMC (time resolved microwave conductivity) measurements. Additionally first growth results of Si-LPE on silicon seeded substrates are presented

Published in:
Photovoltaic Specialists Conference, 1997., Conference Record of the Twenty-Sixth IEEE

Date of Conference: 29 Sep-3 Oct 1997

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